AMD Gears Up for EXPO 1.20: Boosting DDR5 OC Profiles and Introducing CUDIMM Support to AM5 Next Year Technologies

AMD Gears Up for EXPO 1.20: Boosting DDR5 OC Profiles and Introducing CUDIMM Support to AM5 Next Year

AMD is poised to revolutionize the gaming world with its latest memory technology. The tech giant is reportedly advancing its EXPO 1.20 technology, promising enhanced DDR5 memory overclocking profiles and laying the groundwork for future innovations.

AMD’s Advancements with EXPO 1.20

The introduction of EXPO DDR5 memory technology was a game-changer for AMD’s AM5 platform. This innovation brought overclocked memory profiles specifically tuned for Ryzen processors, setting a new standard in the industry. Designed to outshine the older AMP and XMP technologies, EXPO offers seamless one-click overclocking options tailored for AM5 systems.

Recent updates in the Beta version of HWiNFO indicate AMD’s plans to enhance this technology further with EXPO 1.20. While detailed specifications remain under wraps, insiders suggest that new AM5 motherboards will soon support superior DDR5 capabilities.

Intel Z690 & B660 Motherboards Will Feature Support For Both AMD EXPO & XMP DDR5 Memory Kits 3

HWiNFO v8.35: New Features and Enhancements

The latest Beta release of HWiNFO v8.35 introduces a slew of upgrades. Among the highlights are enhanced sensor monitoring for various motherboard series, improved support for Intel’s Nova Lake, and a suite of bug fixes and new features like fan speed monitoring and dedicated NPU sensors.

  • Enhanced sensor monitoring on Colorful B650, B850, X870, Z790, Z890 series.
  • Enhanced support of Nova Lake-H/HX.
  • Fixed a bug when browsing search results in the main window.
  • Increased ETW buffers for PresentMon.
  • Added Arrow Lake Refresh and Panther Lake SKUs.
  • Added fan speed monitoring for ASUS Vivobook Pro 15 N6506.
  • Improved the distinction between Nuvoton NCT6799D/NCT6796D-S/NCT5584D.
  • Added the integrated Stress Test tool.
  • Added AMD Radeon AI PRO R9700S and R9600D.
  • Moved integrated Intel GPU sensor values to a dedicated sensor.
  • Added dedicated AMD and Qualcomm NPU sensors.
  • Added DDR5 sensor for LPCAMM2 modules.
  • Fixed Arrow Lake-S 4P+4E and 6P+12E support.
  • Fixed reporting secondary NVIDIA GPU as fake when disabled.
  • Added more SOCAMM2 details.
  • Added AMD EXPO 1.20 support.
  • Enhanced Nova Lake telemetry.

The Road Ahead: AMD’s Future Plans

AMD’s ongoing innovation doesn’t stop with EXPO 1.20. Looking ahead, the company is working to integrate CUDIMM support into its platforms. While the AM5 platform will persist, this new feature is expected to debut with the Zen 6-based Ryzen family in late 2026, aligning AMD with Intel’s existing support for CUDIMM memory.

Two KLEVV CRAS V RGB DDR5 memory modules are placed on a colorful backlit keyboard.

These technological leaps are set to enhance DDR5 capabilities for both Intel and AMD desktop systems. However, enthusiasts might face challenges with rising costs due to ongoing supply shortages driven by AI demands. Memory prices are projected to continue climbing through 2026, increasing the cost burden for high-performance modules.

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