Intel has been trailing in the chip market, but when it comes to advanced packaging solutions, the company offers competitive alternatives worth considering.
Intel’s Advanced Packaging: A Strong Contender
With the rise of high-performance computing, the need for sophisticated compute solutions has surged beyond what Moore’s Law alone can provide. Companies like AMD and NVIDIA have turned to advanced packaging technologies, integrating ‘multiple chips’ into a single package to enhance chip densities and platform performance. While TSMC has long been a leader in this field, the landscape might be shifting in favor of Intel.
Growing Industry Interest in Intel’s Technologies
Recent job postings from Qualcomm and Apple highlight a rising interest in Intel’s EMIB technology. Apple is on the lookout for a DRAM packaging engineer skilled in technologies like CoWoS and EMIB, while Qualcomm seeks a Director of Product Management for its Data Center Business Unit, requiring knowledge of Intel’s EMIB. This clearly shows a potential shift towards Intel’s offerings.
The Advantages of EMIB and Foveros
Intel’s EMIB technology connects multiple chiplets in a package using a small embedded silicon bridge, eliminating the need for a larger interposer unlike TSMC’s CoWoS. Building on EMIB, Intel’s Foveros Direct 3D packaging technology allows for chip stacking using TSVs, making it a top-tier option in the industry.
The mounting interest from companies like Apple, Qualcomm, and Broadcom highlights Intel’s potential as a key player in the advanced packaging arena. With TSMC facing supply constraints due to high demand, Intel’s alternatives are attracting attention. Even NVIDIA’s CEO has praised Intel’s Foveros technology, indicating a promising path for Intel to capitalize on the growing demand for advanced packaging solutions. Though these job listings don’t guarantee adoption, they certainly underscore a significant industry interest.