Intel's AI Game Plan: Embracing a Broadcom-Style ASIC Model with Foundry and Packaging Services Technologies

Intel’s AI Game Plan: Embracing a Broadcom-Style ASIC Model with Foundry and Packaging Services

Intel is looking to redefine its approach to artificial intelligence by concentrating on two primary domains: ASICs and edge AI. Historically recognized as a leader in general-purpose and server-grade computing, Intel has struggled to keep pace with AI advancements made by NVIDIA and AMD. Former CEO Pat Gelsinger acknowledged the gap in Intel’s AI strategy, and under CEO Lip-Bu Tan, the company is finally shaping a clear path forward. Insights from Intel’s VP John Pitzer at the Barclays Annual Global Technology Conference shed light on their AI ambitions.

Forging Ahead with Edge AI

One of Intel’s significant aims is to harness the power of edge AI through its innovative ‘AI PC’ lineup. This includes the Meteor Lake, Lunar Lake, and the upcoming Panther Lake, all designed to boost edge AI performance by incorporating advanced NPU generations. These developments promise heightened computing capabilities, particularly in mobile SoCs. Additionally, Intel plans to broaden its edge AI portfolio with products such as Crescent Island, which focuses on inference and features LPDDR5X memory.

Embracing the ASIC Revolution

Intel’s strategy also prominently features the burgeoning ASIC sector, led by Srini Iyengar under the Central Engineering Group. As companies like Google and Amazon innovate with their custom silicon solutions, Intel is positioning itself as a comprehensive provider for ASIC manufacturing and advanced packaging. This approach aims to cater to the personalized workload demands of its clients, offering a singular solution in custom silicon production. Intel’s focus on ASICs is set to transform its AI strategy, providing customers with a comprehensive solution while ensuring faster time-to-market figures and close collaboration.

Networking ASICs and Future Prospects

Intel’s VP John Pitzer highlights the potential in the custom networking ASICs arena, with applications in SmartNIC ASICs tailored for network-bound tasks like telemetry and traffic management. The goal is to position Intel alongside competitors like Broadcom and Marvell while offering unique internal foundry services to clients. This move ensures faster delivery and deeper collaboration with ASIC customers. Lip-Bu Tan’s extensive background in custom silicon, stemming from his experience at Cadence, further bolsters Intel’s potential in capitalizing on the ASIC market trends.

Leave a Reply

Your email address will not be published. Required fields are marked *