Intel is making waves in the tech industry as rumors swirl about its potential new deals with major companies like Google. Recent reports suggest that Intel might secure orders from Google for their upcoming Tensor Processing Units (TPUs), highlighting the growing interest in Intel’s advanced packaging capabilities.
Intel’s EMIB Technology Gains Traction Among Tech Giants
Intel Foundry’s advanced packaging services have been attracting significant attention lately, mainly due to the limited packaging facilities available in the US. Big Tech companies are reportedly interested in Intel’s Embedded Multi-die Interconnect Bridge (EMIB) and Foveros packaging technologies. A recent report suggests that Intel could supply packaging for Google’s TPU v9, anticipated in 2027, and Meta’s MTIA AI chip might also incorporate Intel’s advanced technology.
Since launching its standalone Intel Foundry Services (IFS) unit in 2021, Intel has been developing EMIB technology, successfully integrating it into server CPU platforms like Sapphire Rapids and Granite Rapids. As Google prepares to use EMIB in its 2027 TPU v9 and Meta considers it for the MTIA accelerators, IFS is expected to experience significant growth. However, CoWoS remains the preferred solution for NVIDIA and AMD’s high-bandwidth products in the near term.
The Rise of Intel’s Advanced Packaging in the US
Intel’s position as the only provider of this technology in America gives it a strategic advantage, especially as TSMC’s transition of CoWoS to the US is still underway. GPU manufacturers such as NVIDIA and AMD occupy a large portion of TSMC’s capacity, making Intel’s services an attractive option for ASICs.
Intel’s EMIB has been under development for years, becoming crucial to its data center CPU offerings. Additionally, Intel’s Foveros technology is recognized as an industry leader, attracting interest from companies like NVIDIA. Reports indicate that TSMC’s CoWoS supply remains unaffected by Intel’s expansion, suggesting a more diverse and optimistic future for the advanced packaging industry.