Loongson Unveils Powerful 32+ Core Chiplets for Next-Gen 3D7000 CPUs With Sub-10nm Tech, Targeting 2027 Launch Technologies

Loongson Unveils Powerful 32+ Core Chiplets for Next-Gen 3D7000 CPUs With Sub-10nm Tech, Targeting 2027 Launch

Loongson is forging ahead with its ambitious plans to revolutionize the server CPU market. The Chinese semiconductor company is in the early stages of developing its cutting-edge 3D7000 CPU family, expected to make waves in 2027. These upcoming processors aim to pack a remarkable punch with their 32+ core chiplets, promising advancements in performance and efficiency.

Loongson’s Future Vision with the 3D7000 Series

Loongson is gearing up for a significant leap in its server CPU offerings. The 3D7000 series is set to employ a sub-10nm process node, signaling a major technological advancement for the company. This next-gen lineup will redefine expectations by incorporating chiplets that boast 32 cores or more, effectively doubling the core count per chiplet compared to previous models.

The groundwork for these innovations is already underway. Loongson is actively designing IP for Xnm advanced processes and preparing to incorporate modern technologies such as DDR5 and PCIe 5.0. The 3D7000 CPU family is expected to revolutionize server capabilities with its unprecedented core count and cutting-edge technology.

Tracing the Path of Innovation

Prior to the 3D7000 series, Loongson unveiled the 3C60000 processors, which operate on a likely 12nm node. These processors feature 16-core chiplets and can scale up to 64 cores with quad-chiplet models, operating at up to 300W TDPs. Loongson also offers the 3D5000 family, tailored for workstations, with up to 32 cores running at 2.0 GHz.

“We have already started IP design work for X-nanometer advanced processes, and we will begin developing technologies such as phase-locked loops, multi-port register files, DDR5-PHY, and PCIe5-PHY.”

Machine Translated via Loongson

Looking Ahead: Loongson’s Expanding Portfolio

Excitement builds as Loongson also gears up to launch its 9A1000 discrete GPU, a promising addition to the AI PC sector. Prepared to make its mark in the coming year, this entry-level GPU will feature Windows OS driver support and is currently in the tape-out stage. Both the 3D7000 CPUs and the 9A1000 GPU are expected to significantly bolster China’s domestic market, reinforcing the nation’s strategy to reduce dependency on foreign technology. As Loongson continues to push boundaries, the global tech community eagerly awaits the impact of these developments.

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