SK hynix, a major player in the memory manufacturing industry, is gearing up to enhance its advanced packaging capabilities by establishing a 2.5D packaging facility in the United States. This strategic move aims to bolster its presence and production capabilities in the region.
SK hynix’s Strategic Expansion in the US
Amidst the growing concern over the lack of advanced packaging facilities, especially in the US, SK hynix is stepping up to fill the gap. Reports suggest that the company plans to open a new 2.5D packaging plant in Indiana. This initiative is expected to ramp up the production of High Bandwidth Memory (HBM) modules, a key component for many tech giants, and address the current supply chain challenges. Although SK hynix is not going solo in this venture, partnerships are anticipated.
HBM modules are crucial in today’s market, and SK hynix’s reliance on 2.5D packaging allows for seamless integration of HBM with processors using a silicon interposer. While TSMC’s CoWoS technology has been a preferred method for packaging, SK hynix is now looking to establish its packaging lines on American soil. This move is critical to meet the increasing demand from clients like NVIDIA and others.
Collaborations and Future Prospects
Due to limited resources, SK hynix will not manage these facilities alone, opening the door to potential partnerships. Although specific collaborators have not been named, insights suggest that Amkor and Intel Foundry could be prospective allies. Amkor has previously assisted in setting up packaging facilities for other tech firms, while Intel offers its EMIB packaging technology as a possible alternative. The exact details of these partnerships remain to be revealed as SK hynix navigates its collaboration strategy.